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3D Plus
Space-qualified 3D-stacked microelectronics
Space MemoryRad-Hard ICs3D PackagingDefense Electronics
Overview
3D Plus designs and manufactures advanced 3D-stacked microelectronic modules for the most demanding space, defense, and aerospace applications. Their patented stacking technology enables ultra-dense memory, processing, and power solutions that survive the harshest environments — from low-earth orbit to deep space.
Product focus
- Radiation-tolerant memory modules
- Stacked DDR and NAND for space
- High-density 3D packaging
- Aerospace and defense qualification
Certifications & qualifications
- ESCC qualified
- NASA approved
- MIL-STD-883
- ITAR registered
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